Samsung's Second Texas Fab Snags AMD and Nvidia Orders for AI Memory Parts
Samsung is lining up AMD and Nvidia as customers for its second Texas chip plant, which will build base dies for high-bandwidth memory used in AI processors. The 2.7 million-square-foot factory breaks ground this month, with production eyed for 2030. Reuters credits a South Korean newspaper report for the details.
Samsung Electronics is reportedly stacking up big-name customers for its next Texas factory. Advanced Micro Devices and Nvidia are set to have memory components built there, per Reuters, which cited South Korea's Maeil Business Newspaper. The plant would produce base dies for high-bandwidth memory chips — the memory that sits alongside AI processors. Orders are said to cover all planned output, with the bulk of that volume going to AMD.
The numbers behind the build are hefty. The factory will stretch across roughly 2.7 million square feet, about 1.5 times the size of Samsung's first Texas plant, according to Maeil. Construction kicks off this month, equipment installation is expected in 2029, and production is slated to start in 2030. Samsung would run the site on its 2-nanometer process, one of its most advanced manufacturing technologies.
There's already a blueprint next door. Samsung's first Texas plant locked in a $16.5 billion deal with Tesla in July 2025 to build the automaker's next-generation AI chips. If the reported AMD and Nvidia orders hold up, Samsung's contract manufacturing arm would suddenly have three major U.S. customers all plugged into the AI computing boom.
Markets noticed fast. AMD stock rose about 2.3% in pre-market trading Tuesday, while Nvidia gained around 1.4%, according to the report. Retail chatter on Stocktwits shifted too — Nvidia sentiment slipped to 'bearish' from 'neutral' over the past day, while AMD climbed to 'bullish' from 'neutral,' with chatter running at 'high' levels.
Worth knowing what Samsung would actually make here. HBM is memory built for AI workloads, moving huge amounts of data quickly between memory and processors. Each HBM package stacks multiple memory layers, and the base die sits at the bottom, managing the flow of data through the stack. Samsung's job would be those base dies — not the flagship processors AMD and Nvidia design themselves.
TopicsSamsung Electronics · Advanced Micro Devices · Nvidia · Tesla · Reuters · Maeil Business Newspaper · AMD · NVDA
Source: finance.yahoo.com
Written by Paparazzi with AI. Not financial advice.
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